SECURE ELECTRONIC MODULE, DEVICE HAVING A SECURE ELECTRONIC MODULE, AND MANUFACTURING METHOD

摘要

The module (1) has an electrical contact area (5) provided with a surface. An electronic chip (9) is connected to the electrical contact area by connectors (11) through openings (13). A peripheral protection unit (7) defines a protective perimeter around the electronic chip and the connectors, where height of the peripheral protection unit is greater than height of the electronic chip and the connectors. The peripheral protection unit and the electronic chip are fixed on a dielectric support film (3). Independent claims are also included for the following: (1) a method for manufacturing a secure electronic module (2) a method for manufacturing an electronic device.