发明名称 |
Semiconductor devices and fabrication method thereof |
摘要 |
A method for fabricating a semiconductor device includes providing a semiconductor substrate having a first region and a second region; and forming at least one first dummy gate in the first region and at least one second dummy gate in the second region. Further, the method includes forming a dielectric layer with a top surface leveling with a surface of the first dummy gate on the semiconductor substrate; oxidizing a top portion of the second dummy gate to form a protective layer to prevent over-polishing on the second region; removing the first dummy gate to form a first gate trench; forming a first metal layer to fill the first gate trench and cover the protective layer and the dielectric layer; and removing a portion of the first metal layer higher than the dielectric layer to form a first metal gate in the first gate trench. |
申请公布号 |
US9406677(B2) |
申请公布日期 |
2016.08.02 |
申请号 |
US201514691037 |
申请日期 |
2015.04.20 |
申请人 |
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION |
发明人 |
Shao Qun |
分类号 |
H01L21/302;H01L27/092;H01L29/66;H01L29/49;H01L21/8238;H01L21/02;H01L21/3105;H01L21/32;H01L21/3213;H01L21/321;H01L21/311;H01L21/033 |
主分类号 |
H01L21/302 |
代理机构 |
Anova Law Group, PLLC |
代理人 |
Anova Law Group, PLLC |
主权项 |
1. A method for fabricating a semiconductor device, comprising:
providing a semiconductor substrate having a first region and a second region; forming at least one first dummy gate on the semiconductor substrate in the first region and at least one second dummy gate on the semiconductor substrate in the second region; forming a dielectric layer with a top surface leveling with top surfaces of the first dummy gate and the second dummy gate on the semiconductor substrate; oxidizing a top portion of the second dummy gate to form a protective layer to prevent over-polishing on the second region on the second dummy gate; removing the first dummy gate to form a first gate trench; forming a first metal layer to fill the first gate trench and cover the protective layer and the dielectric layer in the second region; and removing a portion of the first metal layer higher than the dielectric layer to form a first metal gate in the first gate trench. |
地址 |
Shanghai CN |