| 发明名称 |
METHOD OF ATTACHING MEMS TO BONDING WAFER |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To relieve stress in manufacturing a MEMS. <P>SOLUTION: The MEMS 12 is attached to a bonding wafer in part by forming a support layer over the MEMS. A first eutectic layer is formed over the support layer. The eutectic layer is patterned into segments 24, 26, 28, 30 to relieve stress. A second eutectic layer 34 is formed over the bonding wafer. An eutectic bond is formed with the segments and the second eutectic layer to attach the bonding wafer to the MEMS. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2013039660(A) |
申请公布日期 |
2013.02.28 |
| 申请号 |
JP20120168421 |
申请日期 |
2012.07.30 |
| 申请人 |
FREESCALE SEMICONDUCTOR INC |
发明人 |
KARLIN LISA H;DESAI HEMANT D |
| 分类号 |
B81C3/00;B81B7/02;H01L23/02 |
主分类号 |
B81C3/00 |
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