OILY CHEMICAL RESISTANT ARTICLES AND OILY CHEMICAL RESISTANT MOISTURE CURABLE HOT MELT ADHESIVE COMPOSITIONS

摘要

Disclosed is an electronic article that includes a first substrate, a moisture cured polyurethane hot melt adhesive composition, a second substrate bonded to the first substrate through the cured adhesive composition, and an electrically conductive element, the cured adhesive composition being derived from at least 15% by weight amorphous polyester polyol having a number average molecular weight of from about 500 grams per mole to about 10,000 grams per mole and a glass transition temperature no greater than 0° C., and including aromatic units, at least 15% by weight crystalline polyester polyol having a glass transition temperature of no greater than 20° C., a melting point of from about 40° C. to about 120° C., and a number average molecular weight of from about 2000 grams per mole to about 20,000 grams per mole, and polyisocyanate. Prior to cure, the adhesive composition exhibits a viscosity no greater than 10,000 centipoise at 120° C.

主权项

1. An electronic article comprising:
a first substrate; a moisture cured polyurethane hot melt adhesive composition; a second substrate bonded to the first substrate through the cured adhesive composition; and an electrically conductive circuit, the cured adhesive composition being derived from a polyurethane prepolymer comprising the reaction product of
at least 15% by weight amorphous polyester polyol having a number average molecular weight of from about 500 grams per mole to about 10,000 grams per mole and a glass transition temperature no greater than 0° C., and comprising aromatic units,at least 15% by weight crystalline polyester polyol having a glass transition temperature of no greater than 20° C., a melting point of from about 40° C. to about 120° C., and a number average molecular weight of from about 2000 grams per mole to about 20,000 grams per mole, andpolyisocyanate.