| 摘要 |
A method of bumping a semiconductor device, including the steps of providing a semiconductor device (100) having a plurality of bumping sites (104), providing a plurality of solder spheres (210), providing a stencil (200) having a plurality of stencil sites (202), each stencil site (202) having a depression and a through hole (204) extending through the stencil(200), placing the plurality of solder spheres (210) on the stencil such that each stencil site of the plurality of stencil sites (202) holds a single solder sphere of the plurality of solder spheres (210), applying a vacuum to the plurality of solder spheres (210), through the vacuum through holes (204), aligning the plurality of solder spheres (210) with the plurality of bumping sites (104) of the semiconductor device (100), releasing the vacuum to release the plurality of solder spheres (210) from the stencil (200) such that the plurality of solder spheres (210) is placed on the plurality of bumping sites (104), and reflowing the plurality of solder spheres (210). A method for packaging a semiconductor die utilizing a stencil and applying vacuum is also disclosed.
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