摘要 |
<p>Wet cleaning a surface made of silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and/or epitaxially grown crystalline materials, such as germanium, comprises bringing surface into contact with hydrofluoric acid solution; and rinsing surface with acidified, deionized water for 1-5, preferably 3 minutes, then a powerful oxidizing agent is added to the deionized water and the rinsing is continued for 5-10, preferably 7 minutes. Wet cleaning a surface made of silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and/or epitaxially grown crystalline materials, such as germanium, comprises: bringing the surface into contact with an hydrofluoric acid (HF) solution with an HF concentration of 0.2-2 (preferably 1) vol.%, in deionized water, for =10 (preferably 4) minutes, the pH of the solution being maintained at 1-2, preferably 1, throughout the duration of the contacting; rinsing the surface with acidified, deionized water for 1-5, preferably 3 minutes, then a powerful oxidizing agent is added to the deionized water and the rinsing is continued for 5-10, preferably 7 minutes, the pH being maintained at =5 (preferably 3-5), throughout step (2); optionally repeating step (1), once or twice, while optionally reducing the contacting time, which is then preferably 30 seconds and 2 minutes, (preferably 1 minute to 30 seconds); optionally repeating step (2), once or twice; and drying the surface.</p> |