| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic head for controlling bending vibration of a projected portion without reducing the length (area) of the projected portion placed in contact with a substance as the bonding object and also provide an ultrasonic bonding apparatus using the same ultrasonic head. <P>SOLUTION: The ultrasonic bonding apparatus comprises a resonator 15 composed of a main axis unit 12 coupled with an ultrasonic vibrator 11 and extended in the travelling direction of ultrasonic wave generated from the ultrasonic vibrator 11, and projected portions 13a, 13b projected in the direction crossing the longitudinal direction from the center area Lc in the longitudinal direction of the main axis unit 12. Moreover, a plurality of holes 41a, 41b are formed symmetrically to the center line Lc in the longitudinal direction of the main axis 12 and within the cross-section almost crossing in orthogonal the projecting direction of the projected portions 13a, 13b at the area near the center area in the longitudinal direction of the main axis unit 12 where the projected portions 13a, 13b are projected. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
