发明名称 POSITIVE RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND COMPOUND
摘要 <p>Disclosed is a positive resist composition containing a base component (A) with an acid-cleavable dissolution inhibiting group whose alkali solubility is increased by the action of an acid, and an acid generator component (B) which generates an acid when exposed to light. The base component (A) contains a compound (A1) which is obtained by substituting a part or all of hydrogen atoms of a phenolic hydroxyl group of a polyvalent phenolic compound, which has a molecular weight of 300-2500 and is represented by the general formula (I) below, with at least one group selected from the group consisting of acid-cleavable dissolution inhibiting groups (II) represented by the general formula (II) below and acid-cleavable dissolution inhibiting groups (III) represented by the general formula (III) below.</p>
申请公布号 WO2006090667(A1) 申请公布日期 2006.08.31
申请号 WO2006JP302961 申请日期 2006.02.20
申请人 TOKYO OHKA KOGYO CO., LTD.;SHIONO, DAIJU;HIRAYAMA, TAKU;HADA, HIDEO 发明人 SHIONO, DAIJU;HIRAYAMA, TAKU;HADA, HIDEO
分类号 C07C69/736;C07C69/734;G03F7/004;G03F7/039;H01L21/027 主分类号 C07C69/736
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