| 摘要 |
In the electrical connecting apparatus, a plurality of pins on a ceramic base plate so as to project from one face of the ceramic base plate, a resin base plate including a plurality of conductive portions electrically connected to those pins on the other face of the ceramic base plate and a plurality of recesses opening on the side of the ceramic base plate in the socket device so as to receive pins individually are disposed, and a plurality of pairs of holding members for releaseably holding the pins received in the recesses are provided, thereby coupling the ceramic base plate with the socket device and coupling the socket device with the wiring base plate.
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