发明名称 高周波振動援用電解研削方法及びその装置
摘要 To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.
申请公布号 JP5935089(B2) 申请公布日期 2016.06.15
申请号 JP20120155396 申请日期 2012.07.11
申请人 ミクロン精密株式会社 发明人 立花 亨;小林 敏;高橋 征幸;村越 親;小池 一徳
分类号 B23H7/38;B23H5/08;B24B1/04;B24D99/00 主分类号 B23H7/38
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