STACKED CHIP-ON-BOARD MODULE WITH EDGE CONNECTOR

摘要

A module can include a module card and first and second microelectronic elements having front surfaces facing a first surface of the module card. The module card can also have a second surface and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket. Each microelectronic element can be electrically connected to the module card. The front surface of the second microelectronic element can partially overlie a rear surface of the first microelectronic element and can be attached thereto.

主权项

1. A module, comprising:
a module card having a first surface, a second surface, and a plurality of parallel exposed edge contacts adjacent an edge of at least one of the first and second surfaces for mating with corresponding contacts of a socket when the module is inserted in the socket; first and second microelectronic elements, the first microelectronic element having a rear surface facing the first surface of the module card, the second microelectronic element having a front surface facing the first surface of the module card, each microelectronic element being electrically connected to the module card, the second microelectronic element partially overlying a front surface of the first microelectronic element and attached thereto; and a plurality of leads extending from chip contacts of the second microelectronic element to the edge contacts.