| 发明名称 |
PROCESS FOR MANUFACTURING A PACKAGE FOR A SURFACE-MOUNT SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
| 摘要 |
A surface-mount electronic device includes a body of semiconductor material, and a lead frame that includes a plurality of contact terminals. The plurality of contact terminals is electrically connected to the semiconductor body. The contact terminals are formed of sintered material. |
| 申请公布号 |
US2016190046(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201514839408 |
申请日期 |
2015.08.28 |
| 申请人 |
STMicrelectronics S.r.l |
发明人 |
Fontana Fulvio Vittorio |
| 分类号 |
H01L23/495;H01L21/48;H01L21/56;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A surface-mount electronic device, comprising:
a body of semiconductor material; and a lead frame including a plurality of contact terminals electrically connected to the body of semiconductor material; and wherein the plurality of contact terminals is formed of a sintered material. |
| 地址 |
Agrate Brianza IT |
