| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device includes a semiconductor element having a front surface and a rear surface, a pair of heat sinks disposed facing each other so as to sandwich the semiconductor element, and attached respectively to the front surface and the rear surface, and a fastening screw fastening the pair of the heat sinks in the facing direction, the fastening screw having insulation property. Threads are arranged on at least a part of the fastening screw in an axis direction of the fastening screw between the pair of the heat sinks. |
| 申请公布号 |
US2016190036(A1) |
申请公布日期 |
2016.06.30 |
| 申请号 |
US201414909772 |
申请日期 |
2014.08.21 |
| 申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA |
发明人 |
ASAI Rintaro |
| 分类号 |
H01L23/40 |
主分类号 |
H01L23/40 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor element having a front surface and a rear surface; a pair of heat sinks disposed facing each other so as to sandwich the semiconductor element, and attached respectively to the front surface and the rear surface; and a fastening screw fastening the pair of the heat sinks in the facing direction, the fastening screw having insulation property; wherein threads are arranged on at least a part of the fastening screw in an axis direction of the fastening screw between the pair of the heat sinks, and sealing resin is filled between the pair of the heat sinks, the sealing resin being in close contact with the threads of the fastening screw. |
| 地址 |
Toyota-shi, Aichi-ken JP |
