SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS

摘要

One or more embodiments are directed to semiconductor packages with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

主权项

1. A semiconductor package, comprising:
a substrate having first and second surfaces and a recess located between the first and second surfaces; an opening in the second surface of the substrate that forms a recess in the substrate between the first and second surfaces; a cantilever pad extending from the substrate and having a first side facing the recess and a second side that forms a portion of the second surface, a conductive finger located on the first surface of the substrate; a conductive pad located on the cantilever pad, the conductive pad being electrically coupled to the conductive finger; and a semiconductor die coupled to the first surface of the substrate, the semiconductor die electrically coupled to the conductive pad.