CONVECTION-COOLED ELECTRONIC SYSTEM

摘要

A convection-cooled electronic system includes an electronic device and a stand. The electronic device has air intake openings in a lower housing portion and air exhaust openings in an upper housing portion. The stand has air intake openings. The stand has a periphery, a flat base, and a slot extending across the widest portion of the stand. The slot has a shape configured to receive the lower portion of the device housing. Heat emitted by electronic components within the device housing creates airflow by convection, which causes air to be drawn into the stand through the stand air intake openings and communicated into the device air intake openings. The air is heated as it passes through the device housing, and the heated air exits the device housing through the air exhaust openings.

主权项

1. A system, comprising:
an electronic device having a device housing and one or more thermal energy-emitting electronic components, the device housing having a lower device housing portion and an upper device housing portion, the lower device housing portion having a plurality of device air intake openings, the upper device housing portion having a plurality of device air exhaust openings, the one or more thermal energy-emitting electronic components mounted in an interior of the device housing between the lower device housing portion and the upper device housing portion along a device airflow path between the device air intake openings and the device air exhaust openings; and a stand having a stand housing with a periphery and a base, the stand housing having a plurality of stand air intake openings distributed about the periphery between an exterior of the stand housing and an interior of the stand housing, the stand housing having a slot extending across the periphery, the slot having a shape corresponding to a shape of the lower device housing portion and configured to receive the lower device housing portion, the device air intake openings extending into the slot and in airflow communication with the stand air intake openings when the lower device housing portion is received in the slot.