WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE

摘要

A wiring substrate includes a resin substrate in which first and second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils.

主权项

1. A module comprising:
a wiring substrate including:
a resin substrate;a metallic foil that is formed on one surface of the resin substrate, and is separated into a first side metallic foil and a second side metallic foil;a first connecting portion formed by a plating film connected to the first side metallic foil on one side of the resin substrate in a thickness direction of the resin substrate;a second connecting portion formed by a plating film connected to the first side metallic foil on another side of the resin substrate in the thickness direction of the resin substrate;a first plating layer that is formed on front and side surfaces of the first side metallic foil, and bottom and side surfaces of the first connecting portion; anda second plating layer that is formed on front and side surfaces of the second side metallic foil, and bottom and side surfaces of the second connecting portion; and an electronic part mounted on the wiring substrate,
wherein the side surface of the first side metallic foil and the side surface of the first connecting portion form a first side surface of the resin substrate, andwherein the side surface of the second side metallic foil and the side surface of the second connecting portion form a second side surface of the resin substrate, which is arranged in parallel with first side surface of the resin substrate.