CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

摘要

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

主权项

1. An apparatus for electroplating metal onto a substrate, the apparatus comprising:
a chamber for holding electrolyte; a substrate holder for holding the substrate in the chamber; and a reference electrode, wherein the reference electrode is (a) shaped like a ring, (b) shaped like an arc, (c) shaped to include multiple independent segments, and/or (d) designed to include a dynamically changeable shape.