| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulative adhesive composition capable of being worked by a simple method, securing bondability and not generating air bubble after cured, when used for bonding a mounting base board with a package component having a soldering ball, and to provide a circuit board mounted with components using the composition.SOLUTION: An insulative adhesive composition includes: (A) an epoxy resin having 2 or more epoxy groups in the molecule; (B) an activator having a carboxylic acid group in the molecule; (C) a thermoplastic curing agent; and (D) a diluent. Here, (A) the component contains: (A1) an epoxy resin having a fluorene skeleton; and (A2) an epoxy resin not having any fluorene skeleton. A percentage of (A1) the component is 10 mass% to 60 mass% based on (A) the component, and (A) the component has a viscosity at 25°C (E type viscometer, 10 rpm) of 1,000 mPa s to 8,000 mPa s. |
