KNOWN GOOD DIE TESTING FOR HIGH FREQUENCY APPLICATIONS

摘要

Embodiments contained in the disclosure provide a method and apparatus for testing an electronic device. An electronic device is installed in a test socket guide. A pusher tip applies a load to the guided coaxial spring probes and forces contact with pads on the device. Test and ground signals are routed through the device and test socket. The apparatus includes a socket having at least one guided coaxial spring probe pin. A socket guide shim is positioned between the receptacle for the electronic device and the socket. A socket guide aids positioning. A pusher tip is placed on the side opposite that of the guided coaxial spring probe pins. The pusher tip mates with a pusher shim and the pusher spring. A top is then placed on the assembly and acts to compress the pusher spring and engage the guided coaxial spring probe pins with the pads on the device.

主权项

1. A method of testing an electronic device, comprising:
installing an electronic device to be tested into a test socket; installing a pusher tip on top of the electronic device installed in the test socket guide; verifying that guided coaxial spring probes within the test socket contact pads on the electronic device; routing test signals and ground signals through the guided coaxial spring probes on the test socket; and recording results of the routing of the test signals and ground signals.