Film/Foil System for LED Applications

摘要

The present disclosure relates to a composite assembly of plastic and metal films which can be used for the interconnection and connection of light emitting diodes. For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection to a heat sink and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.

主权项

1. A method of making an illumination module comprising the following steps:
providing one or more light-emitting diodes; providing a flexible illumination-module circuit board providing a substrate that also forms a heat sink, wherein the flexible illumination-module circuit board is formed by
bonding a metal film to an insulating support layer by an adhesive bond;opening the support layer at sites at which thermal connections are effected between the heat sink and the metal film or between the heat sink and the light emitting diode;applying a thermally conductive adhesive or solder to those sites at which thermal connections are to be formed between the heat sink and the metal film and between the heat sink and the light emitting diode; mounting one or more light emitting diodes on the metal film of the substrate by means of an electrically conductive adhesive or solder; and laminating the flexible illumination-module circuit board to the substrate that simultaneously constitutes the heat sink.