Heatsink, especially a microprocessor heatsink, has a heat conducting element in contact with microprocessor linked by heat conducting pipes to a heat diffusion of capacity equal to twice that of the processor heat capacity

摘要

Fanless electronic circuit, especially a microprocessor, cooling device has a first heat conducting element attached to the circuit and linked to a heat diffuser via vertically aligned head conducting pipes. The heat diffuser has a heat diffusion capacity that is twice that of the circuit heat capacity.