发明名称 CAPACITORLESS DRAM ON BULK SILICON
摘要 A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate (10) is provided, and an array of silicon studs (16) is defined within the silicon substrate. An insulator layer (18) is defined atop at least a portion of the silicon substrate (10), and between the silicon studs (16). A silicon-over-insulator layer (22, 24) is defined surrounding the silicon studs (16) atop the insulator layer(18), and a capacitorless DRAM (26-40) is formed within and above the silicon-over-insulator layer (22, 24).
申请公布号 WO2006135505(A2) 申请公布日期 2006.12.21
申请号 WO2006US17493 申请日期 2006.05.05
申请人 MICRON TECHNOLOGY, INC.;MATHEW, SURAJ;TRIVEDI, JIGISH, D. 发明人 MATHEW, SURAJ;TRIVEDI, JIGISH, D.
分类号 H01L21/84;H01L27/12;H01L29/78 主分类号 H01L21/84
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