发明名称 |
CAPACITORLESS DRAM ON BULK SILICON |
摘要 |
A method of forming capacitorless DRAM over localized silicon-on-insulator comprises the following steps: A silicon substrate (10) is provided, and an array of silicon studs (16) is defined within the silicon substrate. An insulator layer (18) is defined atop at least a portion of the silicon substrate (10), and between the silicon studs (16). A silicon-over-insulator layer (22, 24) is defined surrounding the silicon studs (16) atop the insulator layer(18), and a capacitorless DRAM (26-40) is formed within and above the silicon-over-insulator layer (22, 24). |
申请公布号 |
WO2006135505(A2) |
申请公布日期 |
2006.12.21 |
申请号 |
WO2006US17493 |
申请日期 |
2006.05.05 |
申请人 |
MICRON TECHNOLOGY, INC.;MATHEW, SURAJ;TRIVEDI, JIGISH, D. |
发明人 |
MATHEW, SURAJ;TRIVEDI, JIGISH, D. |
分类号 |
H01L21/84;H01L27/12;H01L29/78 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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