| 摘要 |
A method for cutting a DWDM filter from a substrate is disclosed, including a two-step process having an initial cutting step and a subsequent cutting step. The initial cutting step forms a slot on a substrate according to size requirement of a finished filter product. The slot has a width larger than the thickness of a cutter employed to perform cutting operation on the substrate. The subsequent cutting step, taken in the slot, completely cuts through the remaining thickness of the substrate to separate the filter from the substrate. The two-phase cutting process avoids corner breaking caused by direct contact between the cutter and the coating layers of the substrate.
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