发明名称 |
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM |
摘要 |
An integrated circuit package-in-package system is provided including forming an external interconnect having an upper portion and a lower portion; forming a packaged device; mounting an active device over the packaged device; connecting the active device to the packaged device and the upper portion; and molding the packaged device, the active device, and the upper portion. |
申请公布号 |
US2008029905(A1) |
申请公布日期 |
2008.02.07 |
申请号 |
US20060462537 |
申请日期 |
2006.08.04 |
申请人 |
STATS CHIPPAC LTD. |
发明人 |
MERILO LEO A.;ESPIRITU EMMANUEL;CABLAO PHILIP LYNDON;FILOTEO DARIO S. |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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