| 摘要 |
<p>The power semiconductor module has a circuit carrier (2) and housing (1). The housing has two contact brackets (6) guiding outwards. Each of the contact brackets is electrically connected with an electrically conductive layer (7) such that all the connecting points, which are formed by the connection of the contact bracket with the layer, are arranged on the layer in a plane parallel to the circuit carrier. An independent claim is included for a method for manufacturing a power semiconductor module.</p> |
