| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin film for sealing a thinned solar cell, without breaking or the like of the same, and to provide a method of manufacturing a semiconductor module that uses the same. <P>SOLUTION: A light receiving side sheet 4 made of EVA resin is placed on a front cover 2. A spacer 12 of a given dimension is placed on a light-receiving side sheet 2. Then, solar cells 6 which are electrically connected with each other via an interconnector 7 are placed on the light-receiving side sheet 2. Then, a backside sheet 8 made of EVA resin is placed to cover the solar cells 6. Then, a back cover 10 is placed on the backside sheet 8. Then, a laminate device 14 applies pressure and heat to and dissolves the light-receiving side sheet 4 and backside sheet 8, which sandwich the solar cells 6 therebetween, thus sealing the solar cells 6 in an EVA resin 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
