| 发明名称 |
SOLDERING METHOD AND SOLDERING DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide soldering method/device realizing highly reliable soldering while a damage of a soldering component due to heat is suppressed. <P>SOLUTION: The method for soldering a electronic component 14 to a substrate 11 is provided with a first heating process for heating a whole solder bonding part and a second heating process for heating a part detached from the electronic component 14 in the solder bonding parts. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2006156446(A) |
申请公布日期 |
2006.06.15 |
| 申请号 |
JP20040340286 |
申请日期 |
2004.11.25 |
| 申请人 |
SHINKA JITSUGYO KK |
发明人 |
FUKAYA HIROSHI;YAMAGUCHI SATORU |
| 分类号 |
H05K3/34;B23K1/00;B23K1/005;G11B5/60;G11B21/21 |
主分类号 |
H05K3/34 |
| 代理机构 |
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