Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same

摘要

A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative member 1 having a main surface 10 on which connecting-use electrode layers 41 and 42 are provided to form a device-mounting area 10 a and (b) a frame-shaped member 2 placed on the main surface 10 so as to surround the device-mounting area 10 a. The device-mounting area 10 a has an area that is 1.05 to 4 times the area of a semiconductor light-emitting device LE 1 . A light-emitting-diode-constituting member LE 2 mounts a semiconductor light-emitting device LE 1 on the device-mounting area 10 a of the semiconductor-light-emitting-device-mounting member BL and has a fluorescent body and/or a protective resin LR filling the inside space of the frame-shaped member 2 . A light-emitting diode LE 3 mounts the light-emitting-diode-constituting member LE 2 on a package 7.