| 主权项 |
1. A package, comprising:
a plurality of lead frames configured to extend inwardly from an outer circumferential portion of the package; a die pad region surrounded with the lead frames in a plane view; a semiconductor chip mounted on the die pad region; a plurality of bonding pads disposed on the semiconductor chip; and a plurality of bonding wires configured to connect the lead frames and the bonding pads, respectively, wherein the bonding wires are respectively bonded to front end portions of the lead frames at angles ranging from 45 to 135 degrees with respect to a trace of the front end portions of the lead frames in the plane view, wherein the sides of the semiconductor chip are placed to have an acute angle equal to or smaller than 45 degrees with respect to the trace of the front end portions of the lead frames in the plane view, wherein the semiconductor chip is disposed at a location below where the plurality of lead frames are disposed, and is mounted on the die pad region at a bottom of the package, wherein the plurality of bonding wires connect the front end portions of the plurality of lead frames, which are disposed higher than the plurality of bonding pads within the package, and the plurality of bonding pads, respectively, and wherein all of the plurality of bonding pads are arranged at the sides of the semiconductor chip. |
