| 发明名称 | Method for producing microcarriers | ||
| 摘要 | The present invention relates to a method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first active layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first active layer, (e) etching away the bottom layer and the insulating layer, (f) removing the polymer layer to release the microcarriers. | ||
| 申请公布号 | US9349545(B2) | 申请公布日期 | 2016.05.24 |
| 申请号 | US201314414174 | 申请日期 | 2013.07.22 |
| 申请人 | MYCARTIS NV | 发明人 | Tornay Raphael;Demierre Nicolas;Gamper Stephan;Renaud Philippe |
| 分类号 | H01G13/06;B01L3/00;B81C99/00;G01N33/543 | 主分类号 | H01G13/06 |
| 代理机构 | Kusner & Jaffe | 代理人 | Kusner & Jaffe |
| 主权项 | 1. A method for producing microcarriers comprising the following steps: (a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) etching away the top layer to delineate lateral walls of bodies of the microcarriers, (c) depositing a first layer at least on a top surface of the bodies, (d) applying a continuous polymer layer over the first layer, (e) etching away the bottom layer and the insulating layer, and (f) removing the polymer layer to release the microcarriers. | ||
| 地址 | Zwijnaarde/Ghent BE | ||