发明名称 |
THERMOELECTRIC POWER MODULE |
摘要 |
A thermoelectric power module capable of suppressing diffusion of not only a material of a solder layer but also a material of a solder joint layer into a thermoelectric element, or suppressing oxidation of the thermoelectric element. The thermoelectric power module includes in sequence: a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuss (Bi), tellurium (Te), antimony (Sb), and selenium (Se) as principal components; a first diffusion prevention layer consisting essentially of at least one of molybdenum (Mo) and tungsten (W); a second diffusion prevention layer consisting essentially of at least one of cobalt (Co), titanium (Ti), and an alloy or compound containing them as principal components; and a solder joint layer consisting essentially of at least one of nickel (Ni), tin (Sn), and an alloy or compound containing them as principal components. |
申请公布号 |
US2016172569(A1) |
申请公布日期 |
2016.06.16 |
申请号 |
US201414909158 |
申请日期 |
2014.08.25 |
申请人 |
KELK LTD. |
发明人 |
FUJIMOTO Shinichi;MATSUNAMI Hiroyuki |
分类号 |
H01L35/16;H01L35/08 |
主分类号 |
H01L35/16 |
代理机构 |
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代理人 |
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主权项 |
1. A thermoelectric power module comprising in sequence:
a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuss (Bi), tellurium (Te), antimony (Sb), and selenium (Se) as principal components; a first diffusion prevention layer consisting essentially of at least one of molybdenum (Mo) and tungsten (W); a second diffusion prevention layer consisting essentially of at least one of cobalt (Co), titanium (Ti), and an alloy or compound containing cobalt (Co) and titanium (Ti) as principal components; and a solder joint layer consisting essentially of at least one of nickel (Ni), tin (Sn), and an alloy or compound containing nickel (Ni) and tin (Sn) as principal components. |
地址 |
Kanagawa JP |