发明名称 THERMOELECTRIC POWER MODULE
摘要 A thermoelectric power module capable of suppressing diffusion of not only a material of a solder layer but also a material of a solder joint layer into a thermoelectric element, or suppressing oxidation of the thermoelectric element. The thermoelectric power module includes in sequence: a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuss (Bi), tellurium (Te), antimony (Sb), and selenium (Se) as principal components; a first diffusion prevention layer consisting essentially of at least one of molybdenum (Mo) and tungsten (W); a second diffusion prevention layer consisting essentially of at least one of cobalt (Co), titanium (Ti), and an alloy or compound containing them as principal components; and a solder joint layer consisting essentially of at least one of nickel (Ni), tin (Sn), and an alloy or compound containing them as principal components.
申请公布号 US2016172569(A1) 申请公布日期 2016.06.16
申请号 US201414909158 申请日期 2014.08.25
申请人 KELK LTD. 发明人 FUJIMOTO Shinichi;MATSUNAMI Hiroyuki
分类号 H01L35/16;H01L35/08 主分类号 H01L35/16
代理机构 代理人
主权项 1. A thermoelectric power module comprising in sequence: a thermoelectric element consisting essentially of a thermoelectric material containing at least two kinds of elements of bismuss (Bi), tellurium (Te), antimony (Sb), and selenium (Se) as principal components; a first diffusion prevention layer consisting essentially of at least one of molybdenum (Mo) and tungsten (W); a second diffusion prevention layer consisting essentially of at least one of cobalt (Co), titanium (Ti), and an alloy or compound containing cobalt (Co) and titanium (Ti) as principal components; and a solder joint layer consisting essentially of at least one of nickel (Ni), tin (Sn), and an alloy or compound containing nickel (Ni) and tin (Sn) as principal components.
地址 Kanagawa JP