| 发明名称 |
SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING DEVICE |
| 摘要 |
Certain embodiments provide a solid-state imaging device including a sensor substrate including a microlens, a transparent resin layer provided so as to be in contact with a main surface of the sensor substrate including a surface of the microlens, and a transparent substrate disposed on a top surface of the transparent resin layer. A thermal conductivity of the transparent resin layer is higher than that of air, and a refractive index of the transparent resin layer is lower than that of the microlens and is equal to or lower than that of the transparent substrate. |
| 申请公布号 |
US2016172401(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201514958214 |
申请日期 |
2015.12.03 |
| 申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
KAWASAKI Atsuko;Ueno Soichiro |
| 分类号 |
H01L27/146;H04N5/335;H04N5/363;H04N5/225 |
主分类号 |
H01L27/146 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A solid-state imaging device comprising:
a sensor substrate including a microlens; a transparent resin layer provided so as to be in contact with a main surface of the sensor substrate including a surface of the microlens; and a transparent substrate disposed on a top surface of the transparent resin layer, wherein a thermal conductivity of the transparent resin layer is higher than that of air, and a refractive index of the transparent resin layer is lower than that of the microlens and is equal to or lower than that of the transparent substrate. |
| 地址 |
Minato-ku JP |
