STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

摘要

A chip package structure and a method for forming a chip package are provided. The chip package structure includes a first package which includes at least a semiconductor die, a dielectric structure surrounding the semiconductor die, and a plurality of conductive structures penetrating through the dielectric structure and surrounding the semiconductor die. The package structure also includes an interposer substrate over the first package and a plurality of conductive features in or over the interposer substrate. The package structure further includes a second package over the interposer substrate, and the first package electrically couples the second package through the conductive structures and the conductive features.

主权项

1. A chip package structure, comprising:
a first package, wherein the first package comprises: at least a semiconductor die; a dielectric structure surrounding the semiconductor die; and a plurality of conductive structures penetrating through the dielectric structure and surrounding the semiconductor die; an interposer substrate over the first package; a plurality of conductive features in or over the interposer substrate; and a second package over the interposer substrate, wherein the first package electrically couples the second package through the conductive structures and the conductive features, and the interposer substrate is between the second package and a top surface of the dielectric structure of the first package.