SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS

摘要

Embodiments of semiconductor devices (e.g., RF devices) include a substrate, an isolation structure, an active device, a lead, and a circuit. The isolation structure is coupled to the substrate, and includes an opening. An active device area is defined by a portion of the substrate surface that is exposed through the opening. The active device is coupled to the substrate surface within the active device area. The circuit is electrically coupled between the active device and the lead. The circuit includes one or more elements positioned outside the active device area (e.g., physically coupled to the isolation structure and/or under the lead). The elements positioned outside the active device area may include elements of an envelope termination circuit and/or an impedance matching circuit. Embodiments also include method of manufacturing such semiconductor devices.

主权项

1. A device comprising:
a substrate having a surface; a lead; an isolation structure having a top surface and a bottom surface, wherein the lead is coupled to the top surface of the isolation structure, and the bottom surface of the isolation structure is coupled to the surface of the substrate, and wherein an active device area corresponds to a portion of the surface of the substrate to which the isolation structure is not coupled; an active device coupled to the surface of the substrate within the active device area; and a circuit electrically coupled between the active device and the lead, wherein the circuit includes a plurality of elements, wherein one or more elements of the plurality of elements is positioned outside the active device area, and wherein the one or more elements positioned outside the active device area includes a first capacitor under the lead and comprising a portion of the isolation structure between the lead and the substrate.