| 摘要 |
Semiconductor chip laminates and inductive, capacitive, and electromagnetic shielding laminate structures that can be integrated together to form electronic circuits for use in systems and devices such as smartphones, tablet computers, notebook computers, wearable electronic devices, portable medical devices, servers, networking equipment, industrial equipment, etc. Fabrications of such integrated laminate structures can be modularized into four (4) types of laminates, namely, inductive laminates, capacitive laminates, electromagnetic shielding laminates, and semiconductor chip laminates, which can be vertically laminated together and/or integrated side-by-side with high density to produce the desired electronic circuits, systems, and devices. |
| 主权项 |
1. An integrated laminate structure for use in an electronic system or device, comprising:
a plurality of modular laminate structures, the plurality of modular laminate structures including two or more of a modular inductive laminate structure, a modular capacitive laminate structure, a modular semiconductor chip laminate structure, and a modular electromagnetic shielding laminate structure, wherein the plurality of modular laminate structures are vertically laminated together to form at least part of at least one electronic circuit within the electronic system or device. |
