| 发明名称 |
PACKAGING STRUCTURE |
| 摘要 |
A packaging structure includes a lead frame, a chip, and a packaging material. The lead frame has a pair of opposed first surface and second surface, and has a first recessed region located on the second surface. The chip has a pair of opposed first surface and second surface. The first surface of the chip is fixed on the first recessed region. The packaging material surrounds the lead frame and the chip. The second surface of the chip is exposed from the packaging material, and the first surface of the lead frame is exposed from the packaging material. |
| 申请公布号 |
US2016172281(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201615052899 |
申请日期 |
2016.02.25 |
| 申请人 |
DELTA ELECTRONICS, INC. |
发明人 |
TSAI Hsin-Chang;LEE Peng-Hsin |
| 分类号 |
H01L23/495;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A packaging structure, comprising:
a lead frame having a pair of opposed first surface and second surface, and having a first recessed region located on the second surface; a first chip having a pair of opposed first surface and second surface, wherein the first surface of the first chip is fixed on the first recessed region of the lead frame; and a packaging material surrounding the lead frame and the first chip, wherein the second surface of the first chip is exposed from the packaging material, and the first surface of the lead frame is exposed from the packaging material. |
| 地址 |
Taoyuan City TW |
