| 发明名称 |
STIFFENER TAPE FOR ELECTRONIC ASSEMBLY |
| 摘要 |
Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener. |
| 申请公布号 |
US2016172229(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
US201414568552 |
申请日期 |
2014.12.12 |
| 申请人 |
Intel Corporation |
发明人 |
Brun Xavier;Krishnan Arjun;Mamodia Mohit;Xu Dingying |
| 分类号 |
H01L21/683;H01L21/304;H01L21/78 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A stiffener tape for a wafer, the stiffener tape comprising:
a mounting tape; a metallic stiffener removably attached to the mounting tape; and a die attach film attached to the stiffener. |
| 地址 |
Santa Clara CA US |
