| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package substrate in which a solder diameter that connects a semiconductor and the semiconductor package substrate is not decreased in a multi-exposure part, and a method for manufacturing the semiconductor package substrate.SOLUTION: A method for forming a photo-solder resist pattern to be formed on an outermost surface of a semiconductor package substrate 10 is provided, which includes the steps of: thermally crosslinking a surface layer of an uncrosslinked photo-solder resist layer 13; directly exposing the photo-solder resist layer except for a portion to be removed, by use of a direct image exposure device; peeling an insulating resin protective film 14 and then developing to form a photo-solder resist layer having an opening formed therein; and heating the photo-solder resist layer having the opening formed therein and then exposing the whole surface of the layer.SELECTED DRAWING: Figure 1 |
