发明名称 SOLID STATE IMAGE PICK-UP DEVICE, MANUFACTURING METHOD AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To form a metal light-shielding film and a metal light-shielding wall with a high positional accuracy on a solid state image pick-up device.SOLUTION: The solid state image pick-up device includes: plural photoelectric conversion sections for generating an electric charge corresponding to incident light on each pixel; and a metal light-shielding film which is formed with being laminated on a silicon substrate on which the photoelectric conversion sections are formed as the boundary between the neighboring pixels. The metal light-shielding film is formed of a selective tungsten CVD. This disclosure is applicable, for example, to backside-illumination type CMOS image sensors.SELECTED DRAWING: Figure 6
申请公布号 JP2016131203(A) 申请公布日期 2016.07.21
申请号 JP20150004674 申请日期 2015.01.14
申请人 SONY CORP 发明人 ANDO SACHIHIRO
分类号 H01L27/14;C23C16/04;C23C16/06;H04N5/369 主分类号 H01L27/14
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