RESIN PASTE FOR DIE BONDING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: A resin paste for die bonding is provided to form a die bonding layer with low viscosity, low elasticity, and adhesive strength with high level. CONSTITUTION: A resin paste for die bonding comprises a butadiene resin, a thermal curable component, a filler, a rubber filler, and a solvent of which the absorption ratio is 1% or less after 1 hour in 50% RH atmosphere at 25>=. The containing amount of the rubber filler is 5-28 weight% based on the total amount of the components except for the filler. The resin paste includes carbitol acetate as the solvent and the rubber filler includes a silicon rubber particle.