| 摘要 |
Disclosed is an insulating resin sheet composed of a prepreg, which is used for forming an insulating layer of a multilayer printed wiring board. By using this insulating resin sheet, a sheet-like fiber base contained in the prepreg is not exposed from the surface of the insulating layer. In the insulating resin sheet, a layer of a cured product of a thermosetting resin composition is formed on one side of the prepreg. Preferably, the insulating resin sheet additionally has a supporting layer on the cured product layer. An insulating resin sheet having such a structure can be obtained by bonding a cured product sheet, wherein a cured product layer of a thermosetting resin composition is formed on a supporting body, onto one side of a prepreg. |
