发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern by which a resist pattern having superior features can be formed by using actinic rays except for laser light in a direct drawing process. <P>SOLUTION: The method for forming a resist pattern includes: a step of forming a photosensitive resin composition layer comprising a binder polymer, a polymerizable compound having an ethylenically unsaturated bond and a photopolymerization initiator expressed by the general formula (1) on a substrate; an exposure step of directly drawing a pattern in a region of at least a part of the layer by use of actinic rays prepared by at least partially eliminating light at a wavelength of 350 nm or shorter from light from various types of light sources, to form a photo-cured portion; and a development step of removing a region except for the photo-cured portion. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013068936(A) |
申请公布日期 |
2013.04.18 |
申请号 |
JP20120172377 |
申请日期 |
2012.08.02 |
申请人 |
HITACHI CHEMICAL CO LTD |
发明人 |
AJIOKA YOSHIKI;ISHI MITSURU;ISO JUNICHI;USUBA MANAMI |
分类号 |
G03F7/031;C08F2/44;C08F2/50;G03F7/004;G03F7/027 |
主分类号 |
G03F7/031 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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