发明名称 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern by which a resist pattern having superior features can be formed by using actinic rays except for laser light in a direct drawing process. <P>SOLUTION: The method for forming a resist pattern includes: a step of forming a photosensitive resin composition layer comprising a binder polymer, a polymerizable compound having an ethylenically unsaturated bond and a photopolymerization initiator expressed by the general formula (1) on a substrate; an exposure step of directly drawing a pattern in a region of at least a part of the layer by use of actinic rays prepared by at least partially eliminating light at a wavelength of 350 nm or shorter from light from various types of light sources, to form a photo-cured portion; and a development step of removing a region except for the photo-cured portion. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013068936(A) 申请公布日期 2013.04.18
申请号 JP20120172377 申请日期 2012.08.02
申请人 HITACHI CHEMICAL CO LTD 发明人 AJIOKA YOSHIKI;ISHI MITSURU;ISO JUNICHI;USUBA MANAMI
分类号 G03F7/031;C08F2/44;C08F2/50;G03F7/004;G03F7/027 主分类号 G03F7/031
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