发明名称 Vertical MIM capacitors and method of fabricating the same
摘要 A method of fabricating a vertical MIM capacitor. An insulation layer is formed on the substrate. The insulation layer is patterned to form an opening in a predetermined area of a core electrode. Then, the opening is filled to form a sacrificial plug. Subsequently, the insulation layer is patterned to form a trench in a predetermined area of an outer electrode around the sacrificial plug. A fenced insulation layer is formed around the sacrificial plug simultaneously. After the sacrificial plug is removed, a metal layer is filled in the predetermined area of the core and outer electrodes. A vertical MIM capacitor comprising the core electrode, the fenced insulation layer, and the outer electrode is finally formed. The invention also provides a vertical MIM capacitor.
申请公布号 US2007099390(A1) 申请公布日期 2007.05.03
申请号 US20050263419 申请日期 2005.10.31
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LEE CHARLES;WU CHI-HSI
分类号 H01L21/20 主分类号 H01L21/20
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