多層基板、プリント回路基板、半導体パッケージ基板、半導体パッケージ、半導体チップ、半導体デバイス、情報処理装置および通信装置

摘要

PROBLEM TO BE SOLVED: To obtain a multi-layer board capable of reducing dielectric loss, suppressing common noise generated by mode conversion, and suppressing an increase in costs.SOLUTION: A multi-layer board comprises: a wiring layer 30 that includes signal wiring for transmitting differential signals; a ground layer 20 that includes a ground plane over the entire or partial surface; and a dielectric layer that is provided between the wiring layer 30 and the ground layer 20. The dielectric layer has a first dielectric layer 10 on the wiring layer side and a second dielectric layer 11 on the ground layer side, which have different dielectric loss tangents from each other; and the dielectric loss tangent of the first dielectric layer 10 is smaller than the dielectric loss tangent of the second dielectric layer 11.