| 发明名称 | Electronic modules | ||
| 摘要 | Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate. | ||
| 申请公布号 | US9425069(B2) | 申请公布日期 | 2016.08.23 |
| 申请号 | US201313967806 | 申请日期 | 2013.08.15 |
| 申请人 | Charles Stark Draper Laboratory, Inc. | 发明人 | Racz Livia M.;Tepolt Gary B.;Thompson Jeffrey C.;Langdo Thomas A.;Mueller Andrew J. |
| 分类号 | H01L23/538;H01L21/56;H01L23/31;H01L21/683;H01L23/544;H01L23/00;H01L25/10 | 主分类号 | H01L23/538 |
| 代理机构 | Nutter McClennen & Fish LLP | 代理人 | Nutter McClennen & Fish LLP |
| 主权项 | 1. A structure, comprising: a substrate defining at least one fill hole in a first side thereof and a cavity in a second side thereof, the cavity being in fluidic communication with the at least one fill hole; a dielectric adhesive layer disposed over the cavity on the second side of the substrate, the dielectric adhesive layer at least partially sealing the cavity on the second side of the substrate; and a microelectronic die adhered to the dielectric adhesive layer and at least partially encapsulated within the cavity by an encapsulant. | ||
| 地址 | Cambridge MA US | ||