发明名称 MULTI-LAYER WIRING STRUCTURE, MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREOF
摘要 A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.
申请公布号 US2017027061(A1) 申请公布日期 2017.01.26
申请号 US201514931580 申请日期 2015.11.03
申请人 CYNTEC CO., LTD. 发明人 LIN Chun-Chih;CHEN Yi-Wei;LAI Yi-Ting;LIN Chu-keng;LEE Cheng-Chang
分类号 H05K3/10;H01F27/28;H05K1/02;H05K1/03;H05K1/11;H05K3/46;H01F27/24;H05K1/09 主分类号 H05K3/10
代理机构 代理人
主权项 1. A manufacturing method of a multi-layer wiring structure, comprising steps of: providing a first conductive structure and a second conductive structure, each of the first conductive structure and the second conductive structure comprising a plurality of wiring patterns; disposing an insulating layer between the first conductive structure and the second conductive structure, the insulating layer being thinner than the first conductive structure or the second conductive structure; and laminating the first conductive structure, the insulating layer and the second conductive structure to form the multi-layer wiring structure.
地址 Hsinchu TW