| 摘要 |
A manufacturing method of a flexible device comprises: an adjustment step of adjusting adhesive characteristics of an adhesive layer formed over a supporting substrate; a temporary bonding step of temporarily bonding the flexible substrate; an electronic device formation step of forming an electronic device; and a separation step of separating the flexible substrate. In the adjustment step, the adhesive characteristics of the adhesive layer are adjusted to satisfy a relationship of PB<PA, where PA denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step without undergoing the adjustment step, and PB denotes a peel strength of the adhesive layer after the electronic device formation step, in a case where the adhesive layer undergoes the electronic device formation step after undergoing the adjustment step. |
