发明名称 COPPER-CLADDING SHEET WITH ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive copper-cladding sheet with adhesive high in adhesivity to copper foil and suitable for use in flexible printed wiring boards. SOLUTION: This sheet with adhesive is such that at least one side of an organic insulating sheet is laminated with a copper-cladding adhesive layer; wherein the organic insulating sheet is characterized by comprising a thermoplastic resin including at least one kind selected from (A-1) a noncrystalline polyester and (A-2) an aromatic polycarbonate.
申请公布号 JP2002275434(A) 申请公布日期 2002.09.25
申请号 JP20010079644 申请日期 2001.03.21
申请人 TORAY IND INC 发明人 KOBAYASHI SADAYUKI;KARASAWA HIROO
分类号 B32B7/02;B32B15/08;B32B15/09;B32B27/36;C09J7/02;C09J163/00;C09J167/00;C09J177/00;C09J179/08;(IPC1-7):C09J7/02 主分类号 B32B7/02
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