发明名称 |
COPPER-CLADDING SHEET WITH ADHESIVE |
摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive copper-cladding sheet with adhesive high in adhesivity to copper foil and suitable for use in flexible printed wiring boards. SOLUTION: This sheet with adhesive is such that at least one side of an organic insulating sheet is laminated with a copper-cladding adhesive layer; wherein the organic insulating sheet is characterized by comprising a thermoplastic resin including at least one kind selected from (A-1) a noncrystalline polyester and (A-2) an aromatic polycarbonate. |
申请公布号 |
JP2002275434(A) |
申请公布日期 |
2002.09.25 |
申请号 |
JP20010079644 |
申请日期 |
2001.03.21 |
申请人 |
TORAY IND INC |
发明人 |
KOBAYASHI SADAYUKI;KARASAWA HIROO |
分类号 |
B32B7/02;B32B15/08;B32B15/09;B32B27/36;C09J7/02;C09J163/00;C09J167/00;C09J177/00;C09J179/08;(IPC1-7):C09J7/02 |
主分类号 |
B32B7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|