| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing electronic component element which can prevent adhesion of foreign matters to an electronic component element, to provide an electronic device, and a manufacturing method of the electronic device. SOLUTION: The package for storing electronic component element is provided with an insulating substrate 1 having a recess 1a for storing and loading the electronic component element 3 on an upper face, and a wiring conductor 2 derived from an inner side to the outer side of the recess 1a of the insulating substrate 1. In the package for storing electronic component element, a lid 4 is fitted to the upper face of the insulating substrate 1 so that it covers the recess 1a. In the lid 4, an adhesion layer 5 is formed in a part exposed to the inner side of the recess 1a on a lower face. COPYRIGHT: (C)2006,JPO&NCIPI |
