| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive utilizable in various electronic applications. <P>SOLUTION: One such adhesive is a B-stageable adhesive that offers excellent adhesion to electronic components, such as lids and substrates comprising various materials, including liquid crystal polymer. The adhesive provides latency and the ability to provide a thorough seal between lids and substrates, including those comprising LCP. The adhesive comprises a solvent, one or more solid epoxies, one or more latent hardeners and one or more thixotropic agents. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
